METHOD OF COOLING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE COOLING SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM

There is provided a technique that includes: transferring a substrate (1) from a process chamber (14) to a transfer chamber (3), after processing the substrate (1) disposed at the process chamber (14) while detecting a temperature by a temperature sensor (211) installed at a substrate support (31) c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAGUCHI, Hideto, SUGISHITA, Masashi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!