METHOD OF COOLING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE COOLING SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM

There is provided a technique that includes: transferring a substrate (1) from a process chamber (14) to a transfer chamber (3), after processing the substrate (1) disposed at the process chamber (14) while detecting a temperature by a temperature sensor (211) installed at a substrate support (31) c...

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Bibliographische Detailangaben
Hauptverfasser: YAMAGUCHI, Hideto, SUGISHITA, Masashi
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:There is provided a technique that includes: transferring a substrate (1) from a process chamber (14) to a transfer chamber (3), after processing the substrate (1) disposed at the process chamber (14) while detecting a temperature by a temperature sensor (211) installed at a substrate support (31) configured to support the substrate (1); and cooling the substrate (1) so that the temperature detected by the temperature sensor (211) becomes equal to or lower than a set temperature while the substrate support (31) is located at a predetermined position.