PROCESS FOR MANUFACTURING A SYSTEM IN PACKAGE HAVING A PLURALITY OF LAYERS AND ASSOCIATED MANUFACTURING APPARATUS

The present invention relates to a process for manufacturing a system in package (SiP) having a plurality of layers, comprising, for each current layer, the following steps: - producing (A) a dielectric substrate using an additive manufacturing technique; - depositing (B) an adhesive in receiving re...

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Bibliographische Detailangaben
Hauptverfasser:	CHALAVOUX, Damien, REY, Maxime, ELOI, Pierre
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a process for manufacturing a system in package (SiP) having a plurality of layers, comprising, for each current layer, the following steps: - producing (A) a dielectric substrate using an additive manufacturing technique; - depositing (B) an adhesive in receiving regions; - depositing (C) electronic components in the corresponding receiving regions; - depositing (E) interconnects between the electronic components; - creating (F) at least one interconnection with an adjacent layer; - encapsulating (G) the current layer in a potting material, the potting material forming an exterior surface; - preparing (H) the exterior surface to receive the following layer.