PROCESS FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF AN AIRCRAFT
A process carrying out non-planar three-dimensional forming of at least one segment of a flexible printed circuit board including an electrically insulating polymer film, and, on at least one side of the polymer film, a metallization then carrying out electrodeposition in which a conductive layer is...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A process carrying out non-planar three-dimensional forming of at least one segment of a flexible printed circuit board including an electrically insulating polymer film, and, on at least one side of the polymer film, a metallization then carrying out electrodeposition in which a conductive layer is deposited on at least the metallization of at least the formed segment. |
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