ELECTRONICS MODULE

The invention relates to an electronics module comprising at least one circuit carrier that is populated at least on one side, on which a first electronic circuit of the electronics module is formed. At least regions of the circuit carrier are thermally connected to a cooling device for cooling an electrical and/or electronic component of the first electronic circuit arranged on the circuit carrier. The cooling device has a housing which surrounds an, in particular closed, hollow space for a fluid, in particular coolant. The housing is at least partially or entirely formed by a semiconductor material, in particular based on silicon, wherein at least one further electrical and/or electronic component and/or a second electronic circuit of the electronics module is formed in the semiconductor material.