INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME

Integrated circuit devices and methods of forming the same are provided. The integrated circuit devices include a backside power distribution network structure (BSPDNS), a logic device region (101) and a passive device region (102) on the BSPDNS, a backside insulating layer (114) including a first p...

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Bibliographische Detailangaben
Hauptverfasser: KIM, Tae Sun, SEO, Kang-Ill, HONG, Wonhyuk, LEE, Jongjin
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Integrated circuit devices and methods of forming the same are provided. The integrated circuit devices include a backside power distribution network structure (BSPDNS), a logic device region (101) and a passive device region (102) on the BSPDNS, a backside insulating layer (114) including a first portion extending between the BSPDNS and the logic device region and a second portion extending between the BSPDNS and the passive device region, the passive device region including a semiconductor layer (118) that is in the backside insulating layer, and a dam (130) separating the first portion of the backside insulating layer from the semiconductor layer of the passive device region.