ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE COMPRISING SAME

Disclosed are an electronic device housing, and an electronic device comprising same. An electronic device housing, according to various embodiments, may comprise: a metal substrate; a plastic injection part formed on one area on a surface of the metal substrate; an oxide film layer formed on one ar...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JEONG, Jinhwan, SHIN, Juncheol, IM, Junghyun, CHO, Sungho, KIM, Aeree, HWANG, Hangyu, BAEK, Seungchang, PARK, Joungki, LEE, Yoonhee
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	Disclosed are an electronic device housing, and an electronic device comprising same. An electronic device housing, according to various embodiments, may comprise: a metal substrate; a plastic injection part formed on one area on a surface of the metal substrate; an oxide film layer formed on one area on the surface of the metal substrate; a plating layer formed on one area on the surface of the metal substrate; and a deposition layer formed on the plating layer, wherein the oxide film layer and the plating layer may be formed to be apart from each other. Various other embodiments are also possible.