MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME

The invention relates to a micromechanical component (1) and to a method for producing a micromechanical component (1). The proposed micromechanical component (1) comprises a layer structure and at least one piezoelectric element (10). The piezoelectric element (10) contains a first electrode (5) and a second electrode (27) for generating and/or detecting deflections of a deflection element (16). The deflection element (16) is connected to a mounting (17). The layer structure of the micromechanical component (1) has a silicon substrate (2), a conductive semiconductor layer (26), a piezoelectric layer (7), and a conductive layer film (12). The conductive semiconductor layer (26) forms the first electrode (5), and the conductive layer film (12) forms the second electrode (27) of the piezoelectric element, wherein the conductive semiconductor layer (26) simultaneously forms a support layer (28) for the deflection element (16).