PACKAGE SYSTEM FOR ARTICLE

The present disclosure relates to a system comprising at least one primary package accommodating at least one article, and a secondary package accommodating the primary package, wherein the secondary package comprises a second package material having a water vapor transmission rate lower than about...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BHATTACHARJEE, Gautam, CHEONG, Yuen Sin, HUANG, Dongpo, SHI, Fukuan
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present disclosure relates to a system comprising at least one primary package accommodating at least one article, and a secondary package accommodating the primary package, wherein the secondary package comprises a second package material having a water vapor transmission rate lower than about 100 g/m2/day, as measured according to Water Vapor Transmission Rate Test, and a resistance to compression higher than about 150N.