COMPOSITE POLISHING PAD INCLUDING CARBON NANOTUBES, AND METHOD FOR PRODUCING SAME

The present invention provides a composite polishing pad for CMP, and a method for producing the same. The composite polishing pad for CMP comprises: a polymer substrate layer including a plurality of protrusions formed on the upper surface thereof; and a carbon nanotube layer including carbon nanot...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KANG, Sukkyung, HONG, Seok Ji, CHOI, Jung Hee, RYU, Hyun Jun, KIM, Seong Jae, MIN, Byung Ju, KIM, Sanha, KANG, Min Woo, OH, Nam Gue, KIM, Seung Geun, JEONG, Ji Hun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention provides a composite polishing pad for CMP, and a method for producing the same. The composite polishing pad for CMP comprises: a polymer substrate layer including a plurality of protrusions formed on the upper surface thereof; and a carbon nanotube layer including carbon nanotubes embedded in and fixed to the upper portion of the substrate layer.