POWER SEMICONDUCTOR MODULE ARRANGEMENT

A power semiconductor module arrangement comprises a substrate (10) comprising a dielectric insulation layer (11), and a first metallization layer (111) arranged on a first surface of the dielectric insulation layer (11), at least one semiconductor body (20) arranged on and attached to the first met...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NOLTEN, Ulrich, BAYER, Christoph, ESSERT, Mark, BÜRGER, Matthias
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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