PROCESS OF ENCAPSULATION
The invention relates to a process of encapsulating a compound having a solubility in water of at most 10 g/l at 20°C, comprising the steps of a) Providing a silicon alkoxide based prepolymer modified with a polyalkylene oxide compound, b) Dissolving the compound having a solubility in water of at m...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to a process of encapsulating a compound having a solubility in water of at most 10 g/l at 20°C, comprising the steps of a) Providing a silicon alkoxide based prepolymer modified with a polyalkylene oxide compound, b) Dissolving the compound having a solubility in water of at most 10 g/l at 20°C in a silicon alkoxide having an average of at least two alkoxide groups per molecule to form a non-aqueous solution of the compound,c) Combining an aqueous liquid with the modified prepolymer provided in step a) and the non-aqueous solution prepared in step b) to form an aqueous dispersion, and d) Stirring the aqueous dispersion formed in step c) to form an aqueous dispersion of capsules. |
---|