PROCESS OF ENCAPSULATION

The invention relates to a process of encapsulating a compound having a solubility in water of at most 10 g/l at 20°C, comprising the steps of a) Providing a silicon alkoxide based prepolymer modified with a polyalkylene oxide compound, b) Dissolving the compound having a solubility in water of at m...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: THYSSEN-WALLNER, Volker, MÖLLER, Martin, OMEIS, Jürgen, WEIS, Sebastian, KNIESBURGES, Rainer, KOSTINA, Nina, ZHU, Xiaomin, EBERHARDT, Marc, JAUNKY, Guillaume, Wojciech
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to a process of encapsulating a compound having a solubility in water of at most 10 g/l at 20°C, comprising the steps of a) Providing a silicon alkoxide based prepolymer modified with a polyalkylene oxide compound, b) Dissolving the compound having a solubility in water of at most 10 g/l at 20°C in a silicon alkoxide having an average of at least two alkoxide groups per molecule to form a non-aqueous solution of the compound,c) Combining an aqueous liquid with the modified prepolymer provided in step a) and the non-aqueous solution prepared in step b) to form an aqueous dispersion, and d) Stirring the aqueous dispersion formed in step c) to form an aqueous dispersion of capsules.