THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD
Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness.In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness.In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thixotropic index at 25°C is adjusted to 0.9 or more and less than 1.0. |
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