BONDED SUBSTRATE ARRANGEMENT AND METHOD FOR MANUFACTURING OF SUCH AN ARRANGEMENT
An arrangement (1) is provided comprising a first substrate (10), which is transparent in a defined wavelength range, and a second substrate (20) arranged next to the first substrate (10), wherein the first substrate (10) and/or the second substrate (20) have a coating (12, 22) formed on the side fa...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | An arrangement (1) is provided comprising a first substrate (10), which is transparent in a defined wavelength range, and a second substrate (20) arranged next to the first substrate (10), wherein the first substrate (10) and/or the second substrate (20) have a coating (12, 22) formed on the side facing to-wards an interface between the first substrate (10) and the second substrate (20) and a first laser treated zone (50) comprising weld lines (100), wherein in the first laser treated zone (50) material of the first substrate (10) and second substrate (20) has been melted and mixed to bond the two substrates (10, 20) together. The coating (12, 22) of the first substrate (10) and/or second substrate (20) has, before laser treatment, an absorption for light within the defined wavelength range of less than 10%.Further aspects of the invention relate to a method for manufacturing such an arrangement and the use of such an arrangement. |
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