PHOTOPOLYMERIZABLE COMPOSITION, METHODS OF BONDING AND SEALING, AND AT LEAST PARTIALLY POLYMERIZED COMPOSITION

A photopolymerizable composition comprises at least one free-radically polymerizable compound; at least one organic photoactivatable reducing agent precursor; at least one reducible transition metal compound comprising at least one of cobalt, copper, iron, manganese, nickel, or vanadium; at least on...

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Bibliographische Detailangaben
Hauptverfasser:	CLAUSSEN, Kai U, LEONE, Amanda K, WHITING, Bryan T, MOSER, William H
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES HETEROCYCLIC COMPOUNDS HUMAN NECESSITIES HYGIENE MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MEDICAL OR VETERINARY SCIENCE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A photopolymerizable composition comprises at least one free-radically polymerizable compound; at least one organic photoactivatable reducing agent precursor; at least one reducible transition metal compound comprising at least one of cobalt, copper, iron, manganese, nickel, or vanadium; at least one organic peroxide; and at least one photoinitiator. The at least one photoinitiator does not comprise an organic peroxide. Methods of bonding and sealing, and an at least partially polymerized composition are also disclosed.