SYSTEM AND METHOD FOR RAPID SUBSTRATE COOLING

Disclosed is a cooling system (104) and method for a metal processing system (100). The cooling system (104) includes a cooling header (114), an exhaust system (118), a temperature sensor (128), and a controller (130). The cooling header (114) selectively dispenses a coolant onto a metal substrate (...

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Bibliographische Detailangaben
Hauptverfasser:	SU, Frank, STANISTREET, Timothy Francis, GANTZER, David Edward, EBOLI, Carlos, WRIGHT, David Skingley, GAENSBAUER, David Anthony, NAZRO, Louis Mitchell, EDDIE, Curtis, XAVIER, Renato Rufino
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL ROLLING OF METAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is a cooling system (104) and method for a metal processing system (100). The cooling system (104) includes a cooling header (114), an exhaust system (118), a temperature sensor (128), and a controller (130). The cooling header (114) selectively dispenses a coolant onto a metal substrate (110), and the exhaust system (118) removes heated coolant from the metal substrate (110). The temperature sensor (128) is downstream from the cooling header (114) and detects a temperature profile of the metal substrate (110) across a width of the metal substrate. The controller (130) is communicatively coupled to the cooling header (114) and the temperature sensor (128), and the controller (130) controls the cooling header (114) based at least on a detected temperature profile.