SEMICONDUCTOR DEVICE INCLUDING EXTENDED BACKSIDE CONTACT STRUCTURE
Provided is a semiconductor device which includes: a backside contact plug, formed at a back side of the semiconductor device, below a source/drain region connected to the backside contact plug, wherein the backside contact plug includes a 1st portion which is not vertically overlapped by the circui...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Provided is a semiconductor device which includes: a backside contact plug, formed at a back side of the semiconductor device, below a source/drain region connected to the backside contact plug, wherein the backside contact plug includes a 1st portion which is not vertically overlapped by the circuit element. |
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