SUBSTRATE PROCESSING APPARATUS

The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, and more particularly to a substrate processing apparatus for processing a surface of a substrate by pressing a processing tool against the surface of the substrate while holding a circumfe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KASHIWAGI, Makoto, FUJISAWA, Mao, KOBAYASHI, Kenichi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, and more particularly to a substrate processing apparatus for processing a surface of a substrate by pressing a processing tool against the surface of the substrate while holding a circumferential portion of the substrate with rotating rollers. The substrate processing apparatus includes a plurality of rollers (11A to 11D) arranged around a reference central point (CP) and configured to contact the circumferential portion of the substrate W, a processing tool (3) configured to press a pressing member (21A) against a periphery of the substrate W, and an actuator (22A) configured to apply a pressing force to the pressing member (21A). Two (11A, 11B) of the plurality of rollers (11A to 11D) are arranged adjacent to the pressing member (21A) and located at both sides of the pressing member (21A).