DIE PADDLE STANDOFFS IN SEMICONDUCTOR PACKAGES

DIE PADDLE STANDOFFS IN SEMICONDUCTOR PACKAGES

A leadframe (202) for a semiconductor package is proposed, comprising one or more mechanical standoffs (204) for placing a die (208) at a distance from the leadframe defined by a height of the standoffs and for enabling an adhesive layer (206) between the leadframe and the die for bonding the die to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Fadullo, Marlon, Yandoc, Ricardo, Malveda, Homer, Dimaano Jr, Antonio B
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A leadframe (202) for a semiconductor package is proposed, comprising one or more mechanical standoffs (204) for placing a die (208) at a distance from the leadframe defined by a height of the standoffs and for enabling an adhesive layer (206) between the leadframe and the die for bonding the die to the leadframe. The leadframe includes a substantially planar surface and the standoffs protrude from this surface. Surrounding perimeters, if present, of the leadframe are lower than the standoffs. The leadframe and the standoffs are a one-piece of conducting material and form a die paddle.