A SEMICONDUCTOR TRANSISTOR PACKAGE COMPRISING ELECTRICAL CONTACT LAYERS AND A METHOD FOR FABRICATING THE SAME

A SEMICONDUCTOR TRANSISTOR PACKAGE COMPRISING ELECTRICAL CONTACT LAYERS AND A METHOD FOR FABRICATING THE SAME

A method (100) for fabricating a semiconductor package comprises providing a die carrier (110), disposing a semiconductor die on the die carrier, the semiconductor die comprising one or more contact pads on a first main face thereof (120), applying an encapsulant at least partially to the semiconduc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUERGUT, Edward, SCHOLZ, Wolfgang, ZUDOCK, Frank, ROTH, Alexander, MEYER, Thorsten
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method (100) for fabricating a semiconductor package comprises providing a die carrier (110), disposing a semiconductor die on the die carrier, the semiconductor die comprising one or more contact pads on a first main face thereof (120), applying an encapsulant at least partially to the semiconductor die, the encapsulant embedding at least one electrical connector, the electrical connector being connected with a contact pad or with the die carrier and extending to a main face of the encapsulant (130), and depositing at least one electrical layer onto the main face of the encapsulant and an exposed end of the at least one electrical connector (140).