DYNAMIC IMAGING SYSTEM WORKFLOW OPTIMIZATION

The present invention relates to X-ray imaging. In order to improve the throughout of an X-ray imaging system, an apparatus is provided for managing an imaging workflow of an X-ray imaging system for an upcoming imaging sequence. The apparatus comprises an input unit, a processing unit, and an outpu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VOGTMEIER, Gereon, MSR, Dikshit, VAN BEERS, Paulus René Maria
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention relates to X-ray imaging. In order to improve the throughout of an X-ray imaging system, an apparatus is provided for managing an imaging workflow of an X-ray imaging system for an upcoming imaging sequence. The apparatus comprises an input unit, a processing unit, and an output unit. The input unit is configured to receive data including (i) a current temperature profile of an X-ray anode inside a tube housing of the X-ray imaging system, (ii) information about a heat capability and a cooling rate of the X-ray anode, (iii) information about a heat capability and a cooling rate of the tube housing, (iv) information about a current operation condition of the X-ray imaging system, and (v) information about a planned operation condition of the X-ray imaging system for the upcoming imaging sequence, wherein the planned operation condition comprises a sequence of planned scans, each planned scan being associated with a respective set of planned scan parameters. The processing unit is configured to determine, based on the received data, an estimated temperature profile of the X-ray anode under the planned operation condition for the upcoming imaging sequence. The processing unit is configured to compare the estimated temperature profile of the X-ray anode with a maximum allowable hardware temperature of the X-ray anode. In response to the determination that the estimated temperature profile is greater than or equal to the maximum allowable hardware temperature of the X-ray anode, the processing unit is configured to modify the planned operation condition such that the estimated temperature profile of the X-ray anode under the modified planned operation condition is less than the maximum allowable hardware temperature of the X-ray anode. The modified planned operation condition comprises a change of the sequence of planned scans and/or a change of the set of planned scan parameters for one or more planned scans. The output unit is configured to provide the modified planned operation condition for the upcoming imaging sequence.