HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

According to various embodiments of the present disclosure, an electronic device may be provided, the electronic device comprising: a housing including a first housing and a second housing for guiding sliding movement of the first housing; a display having at least a portion that is configured to be...

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Bibliographische Detailangaben
Hauptverfasser:	MOON, Hongki, LEE, Seungjoo, JUNG, Hyeran, KANG, Seunghoon, PARK, Jongkil
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:	According to various embodiments of the present disclosure, an electronic device may be provided, the electronic device comprising: a housing including a first housing and a second housing for guiding sliding movement of the first housing; a display having at least a portion that is configured to be unfolded on the basis of the sliding movement of the first housing, the display including a first display area disposed on the first housing and a second display area extending from the first display area; an electrical component disposed in the housing; a heat dissipation sheet configured to receive heat generated from the electrical component, the heat dissipation sheet including a bent area facing the first display area and a fixing area facing the second display area; and a slit structure formed in at least a portion of the bent area and having at least a portion extending along a first direction inclined with respect to the sliding direction of the first housing.