COPPER ALLOY, SEMI-FINISHED PRODUCT AND ELECTRICAL CONNECTION ELEMENT MADE OF COPPER ALLOY
Die Erfindung betrifft eine Kupferlegierung mit folgender Zusammensetzung in Gew.-%:Sn:3,0 - 6,5 %,Ni:0,30 - 0,70 %,P:0,15 - 0,40 %,S:0,10 - 0,40 %,Zn:optional bis zu 0,20 %,Fe:optional bis zu 0,50 %,Mn:optional bis zu 0,50 %,Pb:optional bis zu 0,25 %,Rest Kupfer sowie unvermeidbare Verunreinigungen...
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| creator | Heilemann, Julia Nöhrer, Matthias Schober, Patrick Allmendinger, Timo |
| description | Die Erfindung betrifft eine Kupferlegierung mit folgender Zusammensetzung in Gew.-%:Sn:3,0 - 6,5 %,Ni:0,30 - 0,70 %,P:0,15 - 0,40 %,S:0,10 - 0,40 %,Zn:optional bis zu 0,20 %,Fe:optional bis zu 0,50 %,Mn:optional bis zu 0,50 %,Pb:optional bis zu 0,25 %,Rest Kupfer sowie unvermeidbare Verunreinigungen,wobei das Verhältnis von Anteil an Ni zu Anteil an P mindestens 1,1 und höchstens 2,8 beträgt und wobei die Legierung Nickelphosphide enthält.
The composition of a copper alloy is as follows: Sn: 3.0-6.5%; Ni: 0.30-0.70%; P: 0.15-0.40%; S: 0.10-0.40%; Zn: optionally up to 0.20%; Fe: optionally up to 0.50%; Mn: optionally up to 0.50%; Pb: optionally up to 0.25%, with the balance being copper and unavoidable impurities. The ratio of fraction of Ni to fraction of P is at least 1.1 and at most 2.8, and the alloy include nickel phosphides. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4411009A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4411009A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4411009A13</originalsourceid><addsrcrecordid>eNrjZIhy9g8IcA1ScPTx8Y_UUQh29fXUdfP08wz2cHVRCAjydwl1DlFw9HNRcPVxdQ4J8nR29FFw9vfzA3I8_f1Aor6ufiEKvo4urgr-bgrIpvEwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXABMTQ0MDA0tHQ2MilAAAzAMxBg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COPPER ALLOY, SEMI-FINISHED PRODUCT AND ELECTRICAL CONNECTION ELEMENT MADE OF COPPER ALLOY</title><source>esp@cenet</source><creator>Heilemann, Julia ; Nöhrer, Matthias ; Schober, Patrick ; Allmendinger, Timo</creator><creatorcontrib>Heilemann, Julia ; Nöhrer, Matthias ; Schober, Patrick ; Allmendinger, Timo</creatorcontrib><description>Die Erfindung betrifft eine Kupferlegierung mit folgender Zusammensetzung in Gew.-%:Sn:3,0 - 6,5 %,Ni:0,30 - 0,70 %,P:0,15 - 0,40 %,S:0,10 - 0,40 %,Zn:optional bis zu 0,20 %,Fe:optional bis zu 0,50 %,Mn:optional bis zu 0,50 %,Pb:optional bis zu 0,25 %,Rest Kupfer sowie unvermeidbare Verunreinigungen,wobei das Verhältnis von Anteil an Ni zu Anteil an P mindestens 1,1 und höchstens 2,8 beträgt und wobei die Legierung Nickelphosphide enthält.
The composition of a copper alloy is as follows: Sn: 3.0-6.5%; Ni: 0.30-0.70%; P: 0.15-0.40%; S: 0.10-0.40%; Zn: optionally up to 0.20%; Fe: optionally up to 0.50%; Mn: optionally up to 0.50%; Pb: optionally up to 0.25%, with the balance being copper and unavoidable impurities. The ratio of fraction of Ni to fraction of P is at least 1.1 and at most 2.8, and the alloy include nickel phosphides.</description><language>eng ; fre ; ger</language><subject>ALLOYS ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS ; CHEMISTRY ; CONDUCTORS ; CURRENT COLLECTORS ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; INSULATORS ; LINE CONNECTORS ; METALLURGY ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240807&DB=EPODOC&CC=EP&NR=4411009A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240807&DB=EPODOC&CC=EP&NR=4411009A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Heilemann, Julia</creatorcontrib><creatorcontrib>Nöhrer, Matthias</creatorcontrib><creatorcontrib>Schober, Patrick</creatorcontrib><creatorcontrib>Allmendinger, Timo</creatorcontrib><title>COPPER ALLOY, SEMI-FINISHED PRODUCT AND ELECTRICAL CONNECTION ELEMENT MADE OF COPPER ALLOY</title><description>Die Erfindung betrifft eine Kupferlegierung mit folgender Zusammensetzung in Gew.-%:Sn:3,0 - 6,5 %,Ni:0,30 - 0,70 %,P:0,15 - 0,40 %,S:0,10 - 0,40 %,Zn:optional bis zu 0,20 %,Fe:optional bis zu 0,50 %,Mn:optional bis zu 0,50 %,Pb:optional bis zu 0,25 %,Rest Kupfer sowie unvermeidbare Verunreinigungen,wobei das Verhältnis von Anteil an Ni zu Anteil an P mindestens 1,1 und höchstens 2,8 beträgt und wobei die Legierung Nickelphosphide enthält.
The composition of a copper alloy is as follows: Sn: 3.0-6.5%; Ni: 0.30-0.70%; P: 0.15-0.40%; S: 0.10-0.40%; Zn: optionally up to 0.20%; Fe: optionally up to 0.50%; Mn: optionally up to 0.50%; Pb: optionally up to 0.25%, with the balance being copper and unavoidable impurities. The ratio of fraction of Ni to fraction of P is at least 1.1 and at most 2.8, and the alloy include nickel phosphides.</description><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>INSULATORS</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhy9g8IcA1ScPTx8Y_UUQh29fXUdfP08wz2cHVRCAjydwl1DlFw9HNRcPVxdQ4J8nR29FFw9vfzA3I8_f1Aor6ufiEKvo4urgr-bgrIpvEwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXABMTQ0MDA0tHQ2MilAAAzAMxBg</recordid><startdate>20240807</startdate><enddate>20240807</enddate><creator>Heilemann, Julia</creator><creator>Nöhrer, Matthias</creator><creator>Schober, Patrick</creator><creator>Allmendinger, Timo</creator><scope>EVB</scope></search><sort><creationdate>20240807</creationdate><title>COPPER ALLOY, SEMI-FINISHED PRODUCT AND ELECTRICAL CONNECTION ELEMENT MADE OF COPPER ALLOY</title><author>Heilemann, Julia ; Nöhrer, Matthias ; Schober, Patrick ; Allmendinger, Timo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4411009A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>ALLOYS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>INSULATORS</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>Heilemann, Julia</creatorcontrib><creatorcontrib>Nöhrer, Matthias</creatorcontrib><creatorcontrib>Schober, Patrick</creatorcontrib><creatorcontrib>Allmendinger, Timo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Heilemann, Julia</au><au>Nöhrer, Matthias</au><au>Schober, Patrick</au><au>Allmendinger, Timo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER ALLOY, SEMI-FINISHED PRODUCT AND ELECTRICAL CONNECTION ELEMENT MADE OF COPPER ALLOY</title><date>2024-08-07</date><risdate>2024</risdate><abstract>Die Erfindung betrifft eine Kupferlegierung mit folgender Zusammensetzung in Gew.-%:Sn:3,0 - 6,5 %,Ni:0,30 - 0,70 %,P:0,15 - 0,40 %,S:0,10 - 0,40 %,Zn:optional bis zu 0,20 %,Fe:optional bis zu 0,50 %,Mn:optional bis zu 0,50 %,Pb:optional bis zu 0,25 %,Rest Kupfer sowie unvermeidbare Verunreinigungen,wobei das Verhältnis von Anteil an Ni zu Anteil an P mindestens 1,1 und höchstens 2,8 beträgt und wobei die Legierung Nickelphosphide enthält.
The composition of a copper alloy is as follows: Sn: 3.0-6.5%; Ni: 0.30-0.70%; P: 0.15-0.40%; S: 0.10-0.40%; Zn: optionally up to 0.20%; Fe: optionally up to 0.50%; Mn: optionally up to 0.50%; Pb: optionally up to 0.25%, with the balance being copper and unavoidable impurities. The ratio of fraction of Ni to fraction of P is at least 1.1 and at most 2.8, and the alloy include nickel phosphides.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS BASIC ELECTRIC ELEMENTS CABLES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY CONDUCTORS CURRENT COLLECTORS ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS LINE CONNECTORS METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | COPPER ALLOY, SEMI-FINISHED PRODUCT AND ELECTRICAL CONNECTION ELEMENT MADE OF COPPER ALLOY |
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