(POLY)SILSESQUIOXANE-FORMING COMPOSITE COMPOSITION

The present invention relates to a composite composition for forming a composite, for example for potting electronics and/or electrics, in particular power electronics. In order to provide a composite composition which undergoes less shrinkage during curing, and/or dries and/or cures at an accelerated speed, and/or has a low susceptibility to corrosion, the composite composition comprises, relative to the total weight of the composite composition, ≥ 10 wt.% to ≤ 95 wt.% of at least one filler and ≥ 1 wt.% to ≤ 20 wt.% of at least one oligomeric and/or polymeric silanol and/or silsesquioxane prepolymer, in particular polysilsesquioxane prepolymer and/or ≥ 1 wt.% to ≤ 20 wt.% of at least one oligomeric and/or polymeric silanol precursor having hydrolysable groups and/or ≥ 1 wt.% to ≤ 20 wt.% of at least one silanol having hydrolysable groups. The invention also relates to: a method for preparing said composite composition; preparation methods for preparing silane compounds and/or compositions therefor; corresponding silane compounds and/or compositions; a correspondingly prepared composite and/or silsesquioxane; and the use thereof.