AN ADJUSTABLE HEAT SPREADER FOR A HEAT SINK

An adjustable heat spreader comprises a mounting body (13) for mounting to a circuit board (11) having at least one electronic component (12) to be cooled. The mounting body includes an opening into which is fitted a heat spreading insert (16). In use, a contact surface of the insert is able to be b...

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Bibliographische Detailangaben
Hauptverfasser:	RADEMACHER, Falk, REINHOLD, Peter
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An adjustable heat spreader comprises a mounting body (13) for mounting to a circuit board (11) having at least one electronic component (12) to be cooled. The mounting body includes an opening into which is fitted a heat spreading insert (16). In use, a contact surface of the insert is able to be brought into contact against the component (12). The mounting body also has a contact surface (21) provided for interfacing with a mechanically separate heat sink (20). A layer of thermal interface material may be applied between the insert and the component (layer 23), the insert and the heat sink (layer 24) and the mounting body and the heat sink (layer 25).