SUBSTRATE PROCESSING SYSTEM

The present invention continuously performs batch processing and single-wafer processing on substrates by connecting a batch processing apparatus and a single-wafer processing apparatus separated from each other by a relay apparatus. With such a configuration, it is possible to relatively easily ach...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IWASAKI, Akihiro, AMAHISA, Kenji, TANIGUCHI, Shinichi, TOMITA, Tsuyoshi
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention continuously performs batch processing and single-wafer processing on substrates by connecting a batch processing apparatus and a single-wafer processing apparatus separated from each other by a relay apparatus. With such a configuration, it is possible to relatively easily achieve a substrate processing system capable of continuously performing batch processing and single-wafer processing on substrates by surely utilizing technologies cultivated in individual batch processing-type and single-wafer processing-type apparatuses.