SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING

A wafer die assembly includes a first wafer (102) having at least a central cavity (106) defined therein. The wafer die assembly includes a second wafer (112) mounted to the first wafer. At least one of the first or second wafers includes an etched pattern (104). The etched pattern including at leas...

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Bibliographische Detailangaben
Hauptverfasser:	POTASEK, David, FRINK, Sarah, BACKMAN, Roger Alan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A wafer die assembly includes a first wafer (102) having at least a central cavity (106) defined therein. The wafer die assembly includes a second wafer (112) mounted to the first wafer. At least one of the first or second wafers includes an etched pattern (104). The etched pattern including at least one peripheral cavity (108), and a raised area (110) raised relative to the peripheral cavity. A method of assembling a wafer die assembly includes etching a central cavity into a first wafer and etching a pattern into at least one of the first wafer or a second wafer. The first wafer and/or the second wafer includes a raised area raised relative to the peripheral cavity or the central cavity. The method includes bonding the second wafer to the first wafer.