MICROELECTRONIC1 PACKAGES WITH EMBEDDED INTERPOSERS

MICROELECTRONIC1 PACKAGES WITH EMBEDDED INTERPOSERS

An electronic device comprises multiple integrated circuit (IC) dice disposed on a package substrate having a substrate area, a mold layer that includes the IC dice, and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer, and an interpose...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AZIMI, Hamid, MANEPALLI, Rahul N
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device comprises multiple integrated circuit (IC) dice disposed on a package substrate having a substrate area, a mold layer that includes the IC dice, and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer, and an interposer layer extending over the substrate area and comprised of a stiffening material more rigid than a material of the package substrate. The interposer layer includes multiple electrically conductive through layer vias contacting the conductive pillars at a first surface of the mold layer and extending through the stiffening material to a second surface of the interposer layer.