GLASS PATCH INTEGRATION INTO AN ELECTRONIC DEVICE PACKAGE

GLASS PATCH INTEGRATION INTO AN ELECTRONIC DEVICE PACKAGE

Embodiments include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a first substrate, and a second substrate coupled to the first substrate. In an embodiment, the second substrate comprises a core, and the core comprises an organic materia...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN, Haobo, MARIN, Brandon, C, ECTON, Jeremy, D, PIETAMBARAM, Srinivas, V, ARANA, Leonel
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a first substrate, and a second substrate coupled to the first substrate. In an embodiment, the second substrate comprises a core, and the core comprises an organic material. In an embodiment, a third substrate is coupled to the second substrate, and the third substrate comprises a glass layer.