CHIP STRUCTURE WITH MOISTURE BARRIER ALONG OPENING IN EDGE THEREOF AND MANUFACTURING METHOD OF THE CHIP STRUCTURE

A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integr...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Wu, Zhuojie
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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