CHIP STRUCTURE WITH MOISTURE BARRIER ALONG OPENING IN EDGE THEREOF AND MANUFACTURING METHOD OF THE CHIP STRUCTURE

A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integr...

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Bibliographische Detailangaben
1. Verfasser:	Wu, Zhuojie
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integrated circuit chip, and a third portion coupling the first moisture barrier portion to the second moisture barrier portion to complete the moisture barrier between the edge of the integrated circuit chip and the I/O opening. The third portion is distanced from the corner of the integrated circuit chip where the I/O opening meets the edge of the chip to prevent damage to the moisture barrier from fabrication processes, such as chip dicing, chip handling or other processes. Various crack stop configurations are also provided to further protect the moisture barrier from damage.