OPTIMIZED POWER DELIVERY FOR MULTI-LAYER SUBSTRATE

A multi-layer substrate (110) stacking a plurality of insulating substrates supports one or more devices (112,114). Each substrate includes a face supporting conductive traces (140,142,144) and edges surrounding the face at a substantially perpendicular angle. The multi- layer substrate includes a g...

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Bibliographische Detailangaben

Hauptverfasser:	XUE, Jie, PUNJABI, Shobhana, Ram, ACHKIR, D., Brice
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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