OPTIMIZED POWER DELIVERY FOR MULTI-LAYER SUBSTRATE

A multi-layer substrate (110) stacking a plurality of insulating substrates supports one or more devices (112,114). Each substrate includes a face supporting conductive traces (140,142,144) and edges surrounding the face at a substantially perpendicular angle. The multi- layer substrate includes a g...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	XUE, Jie, PUNJABI, Shobhana, Ram, ACHKIR, D., Brice
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A multi-layer substrate (110) stacking a plurality of insulating substrates supports one or more devices (112,114). Each substrate includes a face supporting conductive traces (140,142,144) and edges surrounding the face at a substantially perpendicular angle. The multi- layer substrate includes a ground plane (120) on a first substrate and a power plane (130) on a second substrate. The ground plane (120) is connected to at least one ground pad (122,124) disposed on a first edge of the first substrate, which provides a low inductance ground path to the ground plane (120). The power plane (130) is connected to at least one power pad (132) disposed on a second edge of the second substrate, which provides a low inductance power path to the power plane (130).