LOW-DIELECTRIC-TANGENT SILICA SOL, AND METHOD FOR PRODUCING LOW-DIELECTRIC-TANGENT SILICA SOL
There is to provide silica particles having a dielectric loss tangent of 0.01 or less at 1GHz and satisfying the requirements (i), (ii) and (iii):(i)an average primary particles diameter of 5 nm to 120 nm;(ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface...
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creator | NAKADA, Takeshi SUGISAWA, Masatoshi ARAKI, Megumi EBARA, Kazuya |
description | There is to provide silica particles having a dielectric loss tangent of 0.01 or less at 1GHz and satisfying the requirements (i), (ii) and (iii):(i)an average primary particles diameter of 5 nm to 120 nm;(ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface area by nitrogen adsorption (SN2); i.e., (SH2O/SN2) of 0.6 or less; and(iii) a total silanol group content of 5% or less as determined by the following Formula (1): totalsilanolgroupcontent%=Q2×2/4+Q3×1/4+Q4×0/4 [in Formula (1), each of Q2, Q3 and Q4 is the proportion (%) of the peak areas derived from silicon atom structures], and a silica dispersion. |
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i.e., (SH2O/SN2) of 0.6 or less; and(iii) a total silanol group content of 5% or less as determined by the following Formula (1): totalsilanolgroupcontent%=Q2×2/4+Q3×1/4+Q4×0/4 [in Formula (1), each of Q2, Q3 and Q4 is the proportion (%) of the peak areas derived from silicon atom structures], and a silica dispersion.</description><language>eng ; fre ; ger</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; COMPOUNDS THEREOF ; INORGANIC CHEMISTRY ; METALLURGY ; NON-METALLIC ELEMENTS ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240703&DB=EPODOC&CC=EP&NR=4393878A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240703&DB=EPODOC&CC=EP&NR=4393878A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKADA, Takeshi</creatorcontrib><creatorcontrib>SUGISAWA, Masatoshi</creatorcontrib><creatorcontrib>ARAKI, Megumi</creatorcontrib><creatorcontrib>EBARA, Kazuya</creatorcontrib><title>LOW-DIELECTRIC-TANGENT SILICA SOL, AND METHOD FOR PRODUCING LOW-DIELECTRIC-TANGENT SILICA SOL</title><description>There is to provide silica particles having a dielectric loss tangent of 0.01 or less at 1GHz and satisfying the requirements (i), (ii) and (iii):(i)an average primary particles diameter of 5 nm to 120 nm;(ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface area by nitrogen adsorption (SN2); i.e., (SH2O/SN2) of 0.6 or less; and(iii) a total silanol group content of 5% or less as determined by the following Formula (1): totalsilanolgroupcontent%=Q2×2/4+Q3×1/4+Q4×0/4 [in Formula (1), each of Q2, Q3 and Q4 is the proportion (%) of the peak areas derived from silicon atom structures], and a silica dispersion.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>COMPOUNDS THEREOF</subject><subject>INORGANIC CHEMISTRY</subject><subject>METALLURGY</subject><subject>NON-METALLIC ELEMENTS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj18Q_XdfF09XF1DgnydNYNcfRzd_ULUQj29PF0dlQI9vfRUXD0c1HwdQ3x8HdRcPMPUggI8ncJdfb0c1cgqJeHgTUtMac4lRdKczMouLmGOHvophbkx6cWFyQmp-allsS7BpgYWxpbmFs4GhoToQQAcAQyIg</recordid><startdate>20240703</startdate><enddate>20240703</enddate><creator>NAKADA, Takeshi</creator><creator>SUGISAWA, Masatoshi</creator><creator>ARAKI, Megumi</creator><creator>EBARA, Kazuya</creator><scope>EVB</scope></search><sort><creationdate>20240703</creationdate><title>LOW-DIELECTRIC-TANGENT SILICA SOL, AND METHOD FOR PRODUCING LOW-DIELECTRIC-TANGENT SILICA SOL</title><author>NAKADA, Takeshi ; SUGISAWA, Masatoshi ; ARAKI, Megumi ; EBARA, Kazuya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4393878A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>COMPOUNDS THEREOF</topic><topic>INORGANIC CHEMISTRY</topic><topic>METALLURGY</topic><topic>NON-METALLIC ELEMENTS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKADA, Takeshi</creatorcontrib><creatorcontrib>SUGISAWA, Masatoshi</creatorcontrib><creatorcontrib>ARAKI, Megumi</creatorcontrib><creatorcontrib>EBARA, Kazuya</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKADA, Takeshi</au><au>SUGISAWA, Masatoshi</au><au>ARAKI, Megumi</au><au>EBARA, Kazuya</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LOW-DIELECTRIC-TANGENT SILICA SOL, AND METHOD FOR PRODUCING LOW-DIELECTRIC-TANGENT SILICA SOL</title><date>2024-07-03</date><risdate>2024</risdate><abstract>There is to provide silica particles having a dielectric loss tangent of 0.01 or less at 1GHz and satisfying the requirements (i), (ii) and (iii):(i)an average primary particles diameter of 5 nm to 120 nm;(ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface area by nitrogen adsorption (SN2); i.e., (SH2O/SN2) of 0.6 or less; and(iii) a total silanol group content of 5% or less as determined by the following Formula (1): totalsilanolgroupcontent%=Q2×2/4+Q3×1/4+Q4×0/4 [in Formula (1), each of Q2, Q3 and Q4 is the proportion (%) of the peak areas derived from silicon atom structures], and a silica dispersion.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS COMPOUNDS THEREOF INORGANIC CHEMISTRY METALLURGY NON-METALLIC ELEMENTS ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | LOW-DIELECTRIC-TANGENT SILICA SOL, AND METHOD FOR PRODUCING LOW-DIELECTRIC-TANGENT SILICA SOL |
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