LOW-DIELECTRIC-TANGENT SILICA SOL, AND METHOD FOR PRODUCING LOW-DIELECTRIC-TANGENT SILICA SOL

There is to provide silica particles having a dielectric loss tangent of 0.01 or less at 1GHz and satisfying the requirements (i), (ii) and (iii):(i)an average primary particles diameter of 5 nm to 120 nm;(ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface...

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Hauptverfasser: NAKADA, Takeshi, SUGISAWA, Masatoshi, ARAKI, Megumi, EBARA, Kazuya
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:There is to provide silica particles having a dielectric loss tangent of 0.01 or less at 1GHz and satisfying the requirements (i), (ii) and (iii):(i)an average primary particles diameter of 5 nm to 120 nm;(ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface area by nitrogen adsorption (SN2); i.e., (SH2O/SN2) of 0.6 or less; and(iii) a total silanol group content of 5% or less as determined by the following Formula (1): totalsilanolgroupcontent%=Q2×2/4+Q3×1/4+Q4×0/4 [in Formula (1), each of Q2, Q3 and Q4 is the proportion (%) of the peak areas derived from silicon atom structures], and a silica dispersion.