MULTI-STAGE ARRAY BASED VERTICALLY INTEGRATED POWER DELIVERY
Aspects of this disclosure relate to power delivery to chips in an array. An array of power conversion paths can be positioned vertically relative to the chips of the array. A power conversion path can convert a high voltage, low current signal to a low voltage, high current. The power conversion pa...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Aspects of this disclosure relate to power delivery to chips in an array. An array of power conversion paths can be positioned vertically relative to the chips of the array. A power conversion path can convert a high voltage, low current signal to a low voltage, high current. The power conversion path can include a first power conversion stage and a second power conversion stage. The power conversion path can be implemented in a power supply module, for example. |
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