SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate having a first surface and a second surface facing away from the first surface and including, in a plan view, a main chip region and a sealing region surrounding the main chip region, a front wiring layer on the first surface of the semicondu...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A semiconductor device includes a semiconductor substrate having a first surface and a second surface facing away from the first surface and including, in a plan view, a main chip region and a sealing region surrounding the main chip region, a front wiring layer on the first surface of the semiconductor substrate and including a front wiring structure, a back wiring layer on the second surface of the semiconductor substrate and including a power wiring structure, a front ring structure in the front wiring layer of the sealing region, and a back ring structure in the back wiring layer of the sealing region. |
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