SEMICONDUCTOR DEVICE

A semiconductor device includes a semiconductor substrate having a first surface and a second surface facing away from the first surface and including, in a plan view, a main chip region and a sealing region surrounding the main chip region, a front wiring layer on the first surface of the semicondu...

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Bibliographische Detailangaben
Hauptverfasser: LEE, Kyoungwoo, KIM, Kyungmin, KIM, Gukhee, CHAE, Myeonggyoon, KIM, Beomjin, KIM, Youngwoo, NA, Sangcheol, LEE, Anthony Dongick, HA, Seungseok
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor device includes a semiconductor substrate having a first surface and a second surface facing away from the first surface and including, in a plan view, a main chip region and a sealing region surrounding the main chip region, a front wiring layer on the first surface of the semiconductor substrate and including a front wiring structure, a back wiring layer on the second surface of the semiconductor substrate and including a power wiring structure, a front ring structure in the front wiring layer of the sealing region, and a back ring structure in the back wiring layer of the sealing region.