METHOD FOR RECONSTRUCTING A THICKNESS PROFILE OF A PART TO BE TESTED
A method for reconstruction of a thickness profile of a part to be inspected including for distinct emission points: for a current emission point, emitting ultrasound firings, generating basic echo signals associated with a respective ultrasound firing, selecting a firing producing the basic echo si...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A method for reconstruction of a thickness profile of a part to be inspected including for distinct emission points: for a current emission point, emitting ultrasound firings, generating basic echo signals associated with a respective ultrasound firing, selecting a firing producing the basic echo signal of greatest amplitude, calculating for the selected firing a basic flight time, calculating the coordinates of a surface contact point for the selected firing, calculating a set of potential positions of the internal surface of the part to be inspected as a function of the basic flight time, the coordinates of the contact point of the external surface and a propagation medium in the part to be inspected, the method further including the step of calculating the profile of the internal surface of the part to be inspected by joining separate portions of the sets of potential positions. |
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