ELECTRONIC DEVICE COMPRISING INTERPOSER SUBSTRATE
According to an embodiment of the present disclosure, an electronic device may comprise: a housing; an interposer substrate which is disposed in the housing and includes a first substrate, a second substrate, and an interposer placed between the first substrate and the second substrate; a support me...
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| creator | JANG, Hyeyeon JEON, Jeonggoo CHUN, Woosung LEE, Soyoung CHOI, Seungki |
| description | According to an embodiment of the present disclosure, an electronic device may comprise: a housing; an interposer substrate which is disposed in the housing and includes a first substrate, a second substrate, and an interposer placed between the first substrate and the second substrate; a support member which includes recesses and supports the first substrate and the second substrate; and fastening members at least a part of which pass through the second substrate and which are disposed in the recesses. |
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an interposer substrate which is disposed in the housing and includes a first substrate, a second substrate, and an interposer placed between the first substrate and the second substrate; a support member which includes recesses and supports the first substrate and the second substrate; and fastening members at least a part of which pass through the second substrate and which are disposed in the recesses.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2025</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20250101&DB=EPODOC&CC=EP&NR=4383690A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20250101&DB=EPODOC&CC=EP&NR=4383690A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JANG, Hyeyeon</creatorcontrib><creatorcontrib>JEON, Jeonggoo</creatorcontrib><creatorcontrib>CHUN, Woosung</creatorcontrib><creatorcontrib>LEE, Soyoung</creatorcontrib><creatorcontrib>CHOI, Seungki</creatorcontrib><title>ELECTRONIC DEVICE COMPRISING INTERPOSER SUBSTRATE</title><description>According to an embodiment of the present disclosure, an electronic device may comprise: a housing; an interposer substrate which is disposed in the housing and includes a first substrate, a second substrate, and an interposer placed between the first substrate and the second substrate; a support member which includes recesses and supports the first substrate and the second substrate; and fastening members at least a part of which pass through the second substrate and which are disposed in the recesses.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2025</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB09XF1Dgny9_N0VnBxDfN0dlVw9vcNCPIM9vRzV_D0C3ENCvAPdg1SCA51Cg4Jcgxx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BJsYWxmaWBo4mxkQoAQA0Wyaj</recordid><startdate>20250101</startdate><enddate>20250101</enddate><creator>JANG, Hyeyeon</creator><creator>JEON, Jeonggoo</creator><creator>CHUN, Woosung</creator><creator>LEE, Soyoung</creator><creator>CHOI, Seungki</creator><scope>EVB</scope></search><sort><creationdate>20250101</creationdate><title>ELECTRONIC DEVICE COMPRISING INTERPOSER SUBSTRATE</title><author>JANG, Hyeyeon ; 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an interposer substrate which is disposed in the housing and includes a first substrate, a second substrate, and an interposer placed between the first substrate and the second substrate; a support member which includes recesses and supports the first substrate and the second substrate; and fastening members at least a part of which pass through the second substrate and which are disposed in the recesses.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
| title | ELECTRONIC DEVICE COMPRISING INTERPOSER SUBSTRATE |
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