ELECTRONIC DEVICE COMPRISING INTERPOSER SUBSTRATE

ELECTRONIC DEVICE COMPRISING INTERPOSER SUBSTRATE

According to an embodiment of the present disclosure, an electronic device may comprise: a housing; an interposer substrate which is disposed in the housing and includes a first substrate, a second substrate, and an interposer placed between the first substrate and the second substrate; a support me...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JANG, Hyeyeon, JEON, Jeonggoo, CHUN, Woosung, LEE, Soyoung, CHOI, Seungki
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:According to an embodiment of the present disclosure, an electronic device may comprise: a housing; an interposer substrate which is disposed in the housing and includes a first substrate, a second substrate, and an interposer placed between the first substrate and the second substrate; a support member which includes recesses and supports the first substrate and the second substrate; and fastening members at least a part of which pass through the second substrate and which are disposed in the recesses.