CHIP PACKAGING STRUCTURE, FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE

This application provides a chip packaging structure and a manufacturing method thereof, and an electronic device. The chip packaging structure includes a re-distribution layer, a plastic packaging structure wrapping at least two dies, and a support carrier board. The plastic packaging structure is fixed on the re-distribution layer. The support carrier board is fixed on a side that is of the plastic packaging structure and that is away from the re-distribution layer. The support carrier board includes a non-metal material. The support carrier board is rigidly connected to each die in the plastic packaging structure. The support carrier board is manufactured by using the non-metal material, so that the support carrier board can match a rigid bonding layer that is not affected by a temperature, to be rigidly connected to the die. In this way, in a plastic packaging craft process, the die can withstand a fluid pressure of a plastic packaging material, shift of the die is reduced, and craft difficulty of the chip packaging structure is reduced. After the chip packaging structure is manufactured, the support carrier board is reserved inside the chip packaging structure. Because the support carrier board has a structural support function for the die, reliability of the chip packaging structure can be improved.