SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

The present invention relates to a semiconductor structure (100) comprising:- a wafer (110) comprising a first bonding face (111),- an array of chiplets (A_1) assembled in one piece and having a second bonding face (A_1_2).Moreover, the area of said second bonding face is smaller than the area of sa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SCANNELL, Mark, VOIRON, Frédéric
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!