SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

The present invention relates to a semiconductor structure (100) comprising:- a wafer (110) comprising a first bonding face (111),- an array of chiplets (A_1) assembled in one piece and having a second bonding face (A_1_2).Moreover, the area of said second bonding face is smaller than the area of sa...

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Bibliographische Detailangaben
Hauptverfasser:	SCANNELL, Mark, VOIRON, Frédéric
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a semiconductor structure (100) comprising:- a wafer (110) comprising a first bonding face (111),- an array of chiplets (A_1) assembled in one piece and having a second bonding face (A_1_2).Moreover, the area of said second bonding face is smaller than the area of said first bonding face, and said second bonding face being connected by hybrid bonding to said first bonding face.