METHOD AND DEVICE FOR DEPOSITING COMPONENTS ON A SUBSTRATE

A deposition device (1) is provided for depositing components (CMP) on a substrate (STR). The deposition device (1) comprises a substrate holder (2), a component carrier (3), a power supply (4) and a support module (5) for supporting the component carrier (3). The substrate holder (2) has a substrat...

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Bibliographische Detailangaben
Hauptverfasser:	KOLDEWEIJ, Robin Bernardus Johannes, HENDRIKS, Rob Jacob
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A deposition device (1) is provided for depositing components (CMP) on a substrate (STR). The deposition device (1) comprises a substrate holder (2), a component carrier (3), a power supply (4) and a support module (5) for supporting the component carrier (3). The substrate holder (2) has a substrate support surface (2s) for holding the substrate (STR). The component carrier (3), which is supported by the support module has a component carrier surface (3s) facing the substrate support surface (2s) for carrying the components to be deposited on the substrate. The component carrier (3) comprises a resistive heater layer (31) for thermally inducing a deformation of the component carrier (3) to move the component carrier surface (3s) towards the substrate support surface (2s). The power supply (4) is configured to generate a deflection pulse (Pd), being an electric power pulse to the resistive heater layer (31) for said thermally inducing a deformation. Also a corresponding deposition method is provided.