A METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE WITH IMPROVED THERMAL PERFORMANCE

A METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE WITH IMPROVED THERMAL PERFORMANCE

A method (100) for fabricating a semiconductor package comprises providing a mold comprising a mold cavity (110), providing a semiconductor device comprising a plurality of semiconductor modules, each one of the semiconductor modules comprising at least one semiconductor die disposed on a substrate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: REYNOSO, Dexter Inciong, WAGIMAN, Mohamad Yazid, YONG, Khai Seen
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method (100) for fabricating a semiconductor package comprises providing a mold comprising a mold cavity (110), providing a semiconductor device comprising a plurality of semiconductor modules, each one of the semiconductor modules comprising at least one semiconductor die disposed on a substrate (120), placing the semiconductor device in the mold cavity (130), providing a mold material in a softened state and at least partially filling of the mold cavity with the mold material through a gate (140), curing of the mold material (150), and sawing the cured intermediate product along saw lines separating the semiconductor modules from each other (160).