CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

A circuit board according to an embodiment includes a first insulating layer including an upper and lower surface; and a first circuit pattern embedded at the upper surface of the first insulating layer, wherein the upper surface of the first insulating layer includes a portion that does not overlap...

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Hauptverfasser:	NAM, Sang Hyuck, KWON, Myung Jae, YEO, Ki Su, YOO, Chang Woo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	NAM, Sang Hyuck KWON, Myung Jae YEO, Ki Su YOO, Chang Woo
description	A circuit board according to an embodiment includes a first insulating layer including an upper and lower surface; and a first circuit pattern embedded at the upper surface of the first insulating layer, wherein the upper surface of the first insulating layer includes a portion that does not overlap the first circuit pattern in a vertical direction, and the portion of the upper surface of the first insulating layer has a step.
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language	eng ; fre ; ger
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
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