CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

A circuit board according to an embodiment includes a first insulating layer including an upper and lower surface; and a first circuit pattern embedded at the upper surface of the first insulating layer, wherein the upper surface of the first insulating layer includes a portion that does not overlap...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAM, Sang Hyuck, KWON, Myung Jae, YEO, Ki Su, YOO, Chang Woo
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A circuit board according to an embodiment includes a first insulating layer including an upper and lower surface; and a first circuit pattern embedded at the upper surface of the first insulating layer, wherein the upper surface of the first insulating layer includes a portion that does not overlap the first circuit pattern in a vertical direction, and the portion of the upper surface of the first insulating layer has a step.