CIRCUIT BOARD WITH BUILT-IN COMPONENTS
s: a first conductive wiring layer (10); a second conductive wiring layer (20) stacked on the first conductive wiring layer (10); an insulating layer (30) formed between the first conductive wiring layer (10) and the second conductive wiring layer (20); at least one pair of semiconductor elements bu...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | s: a first conductive wiring layer (10); a second conductive wiring layer (20) stacked on the first conductive wiring layer (10); an insulating layer (30) formed between the first conductive wiring layer (10) and the second conductive wiring layer (20); at least one pair of semiconductor elements built in the insulating layer (30) and each including a first electrode terminal and a second electrode terminal. The first electrode terminal (41) of a first semiconductor element (40), which is one of the pair of the semiconductor elements, is connected to the first conductive wiring layer (10), the second electrode terminal (52) of a second semiconductor element (50), which is the other of the pair of semiconductor elements, is connected to the second conductive wiring layer (20), and the first conductive wiring layer (10) and the second conductive wiring layer (20) are formed such that a current flowing through the first conductive wiring layer (10) and a current flowing through the second conductive wiring layer (20) are symmetrical and opposite when viewed from a direction passing through the first conductive wiring layer (10) and the second conductive wiring layer (20). |
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