CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF

CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF

A coreless substrate package (1) includes a coreless substrate (20); a package device (10) mounted on the coreless substrate (20); an underfill material (310) filling into a space between the package device (10) and the coreless substrate (20); a stiffener ring (40) disposed on a top surface (20a) o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WONG, Te-Chi, TSAO, Pei-Haw
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A coreless substrate package (1) includes a coreless substrate (20); a package device (10) mounted on the coreless substrate (20); an underfill material (310) filling into a space between the package device (10) and the coreless substrate (20); a stiffener ring (40) disposed on a top surface (20a) of the coreless substrate (20) along perimeter of the coreless substrate (20); and a gap fill material (50) disposed in a gap between the stiffener ring (40) and the package device (10).