MICROFLUIDIC CHIP AND METHOD FOR MANUFACTURING MICROFLUIDIC MICROCHIP

There is provided a microfluidic chip and a method of producing the microfluidic chip, which can suppress poor bonding between a resin layer forming a channel and a lid component, and can suppress deformation of the channel. A microfluidic chip (1) includes a substrate (10), a partition layer (11) c...

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Bibliographische Detailangaben
Hauptverfasser:	HAKII, Hidemitsu, FUKUGAMI, Norihito
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEPARATION SPRAYING OR ATOMISING IN GENERAL TESTING THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	There is provided a microfluidic chip and a method of producing the microfluidic chip, which can suppress poor bonding between a resin layer forming a channel and a lid component, and can suppress deformation of the channel. A microfluidic chip (1) includes a substrate (10), a partition layer (11) configured by a resin material and provided on the substrate (10) to form a channel, and a cover layer (12) provided on the surface of the partition layer (11) facing away from the substrate (10), wherein the partition layer (11) has an elastic modulus in the range of 1 MPa or more and 10 GPa or less.